Quels sont les avantages de la découpe en fil diamanté?
La technologie de coupe en fil de diamant est une technologie de coupe avancée pour remplacer la coupe traditionnelle au mortier libre, qui est largement utilisé dans le domaine de la découpe de plaquettes de silicium dans les industries photovoltaïque et des semi-conducteurs.
Son processus de développement est le suivant:
La première étape: originaire du Japon, Principalement coupé avec du mortier abrasif libre, y compris les abrades tels que le zirconium corindum et le carbure de silicium. La deuxième étape: Japan Asahi Diamond Industry Co., LTÉE. (ci-après dénommés “Diamant Asahi”) and other companies began to produce 17.5mm diameter of fine grained diamond lines.The third stage: Diamant Asahi, Japan Nakamura Superhard Co., LTÉE. (ci-après dénommés “Nakamura Superhard”) and other companies began to produce ultra-fine grained diamond lines with a diameter of 14.5mm.The fourth stage: diamond wire manufacturing enterprises represented by China have gradually risen in the market, and diamond wire cutting technology has been widely used.
The advantages of diamond Wire loop cutting mainly include——Cutting speed, Rendement élevé, high productivity.
Higher precision and lower damage layer, material loss and burn when cutting thin sheets, which is conducive to cutting thinner silicon wafers or other high-value raw materials.
Quality control, low cost per piece.
The use of water-based grinding fluid is conducive to improving the working environment and simplifying the post-processing procedures such as cleaning, which is simple and environmentally friendly.
Donc, diamond loop cutting has become the mainstream cutting process for crystalline silicon slicing in the photovoltaic industry. Since 2015, Zhengzhou Ensolltools Technology Co., Ltée. began to deeply cultivate the field of diamond wire saw cutting, product competitiveness continues to improve, and market share increases year by year.
In terms of diamond loop, the company continues to lead the industry in fining, has broken through the 0.3mm diamond loop technical barriers, and actively develop reserves and trial production of finer diameter diamond loop, With the diamond loop cutting equipment developed by us, thinner wire diameter helps to reduce the cutting loss of raw materials, especially rare and valuable materials, while improving cutting accuracy and efficiency. Reduce cutting energy consumption.
