炭化ケイ素切断推奨機器 – ダイヤモンドワイヤーループ切断鋸

炭化ケイ素の切断方法には多くの種類があります, その中には、砥石の切断が含まれます, diamond wire saw cutting, laser cutting and so on.

Grinding wheel cutting is the use of high-speed rotating grinding wheel to cut and remove silicon carbide, which is suitable for various shapes and sizes of silicon carbide cutting workpiece, but it is not suitable for specific special shapes of silicon carbide cutting.

ダイアモンドワイヤーソー cutting is a way of using a wire saw to cut materials with high-speed rotation, 高精度と高効率の利点があります, and is suitable for cutting a variety of hard and brittle materials.

Laser cutting is the use of high-energy laser beam irradiation on the surface of silicon carbide, so that the surface material quickly melt, vaporize or reach the ignition point, while the high-speed airflow will melt or burn the material away, so as to achieve cutting. Laser cutting has the characteristics of high precision, high speed and high adaptability, but requires the use of expensive equipment and high energy consumption.

概要, the choice of cutting method depends on the specific material properties, size and processing needs.With the continuous development of technology, more and more enterprises are more inclined to use diamond wire loop saw cutting, under the premise of maintaining high precision and efficiency, the cost is also the lowest!